SAN JOSE, Calif. — Continuing on its collision course with Applied Materials Inc., rival KLA-Tencor Corp. is making a new bid in the defect review and classification equipment market. KLA-Tencor ...
Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these ...
Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...
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